Mechatronics in PLM: Increasing Complexity and New Requirements
On May 5, 2026, XPLM will participate in the INNEO Digitalization Conference in Stuttgart. The event is considered one of the key industry gatherings around CAD, PLM and digital product development and provides a platform for professional exchange on current challenges and best practices.
After having participated as an exhibitor in 2025 and gaining valuable insights through discussions with customers and partners, XPLM is pleased to be part of the conference again in 2026. This year’s focus will be on the question of how mechatronic products can be efficiently and systematically represented in PLM.
Modern products combine mechanics, electrical engineering, electronics and software each with its own development and change cycles. As a result, many companies face challenges such as parallel bills of materials, cross-domain releases and limited transparency along the product lifecycle.
During the conference, XPLM will demonstrate how PLM systems such as Windchill can support the holistic representation of mechatronic product structures. Key elements include an end-to-end product structure with variant logic, multi-BOM management as well as consistent change and configuration management. A clear single source of truth forms the foundation for efficient collaboration across all disciplines.
Following initial joint projects and previous participation in the event, XPLM looks forward to engaging with customers, partners and interested parties in Stuttgart and to continuing the professional exchange in 2026.
